NANO 205Nanosystems Integration
Scaling issues and hierarchical assembly of nanoscale components into higher order structures which retain desired properties at microscale and macroscale levels. Novel ways to combine top-down and bottom-up processes for integration of heterogeneous components into higher order structures. Cross-listed with CENG 215. Students may not receive credit for both NANO 205 and CENG 215.
Prerequisites
From the catalog: “consent of instructor.”